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What is the release film for metal heat transfer

Update:13 Oct 2020

What is a release film for metal heat transfer and what are its characteristics

Thermal transfer release film is a high temperature resistant release film that can be used in the production of rigid and flexible circuit boards. This release film has passed the patented process technology, with the help of strict quality control, and is cured in the later stage. It has the characteristics of high temperature resistance, good release effect, and no pollution during the pressing process.

Thermal transfer is an emerging printing process, which has been introduced from abroad for more than 10 years. This process printing method is divided into two parts: transfer film printing and transfer processing. The transfer film printing adopts halftone printing (resolution up to 300dpi), and the pattern is printed on the surface of the film in advance. The printed pattern has rich layers, bright colors, and ever-changing , The color difference is small, the reproducibility is good, it can meet the requirements of the designer, and it is suitable for mass production; the transfer process is processed by a heat transfer machine (heating and pressure) to transfer the exquisite pattern on the transfer film to the product On the surface, the ink layer and the surface of the product melt into one body after forming, which is vivid and beautiful, greatly improving the grade of the product. However, due to the high technical content of this process, many materials need to be imported.

Performance characteristics:

Release profiles for rigid, flexible circuit boards, HDI boards, FPC boards, flexible and rigid boards, etc.

Color: milky white, matte, transparent, etc.

The release surface has double-sided or single-sided release film, which is environmentally friendly and pollution-free

High temperature resistance 200±5°C

Smooth surface, excellent molding performance, easy peeling, easy operation

Thickness: 25UM, 27UM, 30UM, 32UM, 36UM, 50UM, etc.

RCX-RF release film does not release gas, there is no swarf, no interlayer bonding, no vacuum system pollution, and no impact on the surface quality of the circuit board

Harmless to the environment: it does not contain ozone-depleting substances, halogen-free elements, and meets the latest EU ROHS requirements